Professor Kentaro Kaneko served as the local arrangement chair and session chair at the international conference, ICSJ2024

The 13th IEEE CPMT Symposium Japan (ICSJ2024), an international conference on semiconductor packaging technology, was held at Ritsumeikan University’s Suzaku Campus from November 13 to 15, 2024, and with 294 participants, it became the largest ICSJ event ever. Continuing from last year, Professor Kentaro Kaneko (RARA Fellow) served as the local arrangement chair.

The IEEE is the largest professional organization in the field of electronics and electrical engineering, with over 400,000 members worldwide, and the IEEE EPS is one of its divisions. It has a strong presence in the United States, Europe, Asia, and especially in Japan, China, and Taiwan. Another of the ICSJ’s main features is that its steering committee is made up of leading researchers and members of leading companies in the semiconductor field. Accordingly, there are many presentations from those working in the field of semiconductor packaging technology, and the conference is characterized by discussions on practical semiconductor packaging technology in addition to the latest academic fields, making it a place where academic researchers and corporate researchers from around the world gather.

Last year, the conference was held at Ritsumeikan University for the first time under the leadership of Prof. Kaneko, and the management and support framework of the University was highly praised by the conference committee members. Consequently, it was decided to hold the conference at the University for two consecutive years.

On the opening day, Chancellor Yoshio Nakatani gave the opening address, saying, “I hope that this conference will further expand the possibilities of semiconductor technology and provide new inspiration and opportunities for exchange in the research and technological development of everyone gathered here,” and during the conference, there was a lot of exchange of opinions among the participants. Prof. Kaneko gave a talk as the session chair and lead at the session “Power Electronics Materials and devices of UWBG and WBG semiconductors” on the final day.

For more information, please visit the website below.
https://www.ieee-csj.org/